Ultra-compact Multiprotocol I/O Modules

By 16 June 2014

The 32 mm slim TBEN-S modules from Turck can be operated automatically in Profinet, Modbus TCP or EtherNet/IP thanks to the multiprotocol communication

Turck presents the first ultra-compact, digital block-I/O modules of the new TBEN-S (Small) series. The fully potted IP67 modules are only 32 mm slim and 144 mm short and allow the assembly directly on the machine. With their extended temperature range from -40 °C to +70 °C degrees, the devices are highly versatile in application. Despite the compact design every TBEN-S module can be operated without additional gateways in each of the three Turck0614_72Ethernet systems Profinet, Modbus TCP or EtherNet/IP. Thanks to the utilized Turck multiprotocol technology in this series, the devices recognize the used protocol automatically by listening the communication during the start-up phase. An integrated switch allows the use of the devices in line topology.

The TBEN-S modules will be available in five variants in the fourth quarter: each with four digital inputs and outputs, eight digital inputs with module diagnostics, eight digital inputs with channel diagnostics, eight digital outputs as well as eight universal digital inputs and outputs. The outputs switch a current of up to 2 A. Each output channel is continuously monitored by the integrated diagnostic system with circular buffer, which simplifies troubleshooting and reduces downtimes significantly. The internal web server, which can be used to display diagnostics in plain text, also contributes to this. The web page has been set up following the concept of “Responsive Design” so that a smartphone can also be used for easy diagnosis.